GF Machining AgieCharmilles CUT 3000 X

$320,000 - $450,000 Updated 2026-03-19

Key Specifications

X / Y / Z Travel

500 x 350 x 256 mm (19.7 x 13.8 x 10.1 in)

U / V Travel

±70 mm (±2.8 in)

Max Workpiece Dimensions

1050 x 650 x 250 mm (41.3 x 25.6 x 9.8 in)

Max Workpiece Weight

400 kg (880 lb) with bath

Wire Diameter Range

0.10 - 0.30 mm (0.05-0.07 mm optional)

Total Positioning Accuracy

±1.5 µm (laser-calibrated)

Overview

The GF Machining Solutions AgieCharmilles CUT 3000 X is the accuracy-optimized larger-travel wire EDM in GF's CUT 2000/3000 series, combining the expanded 500 x 350 mm work envelope of the CUT 3000 platform with laser-calibrated positioning accuracy down to ±1.5 µm. This makes the CUT 3000 X the machine of choice for medium-size precision components where both travel capacity and absolute dimensional accuracy are non-negotiable.

The CUT 3000 X shares its mechanical platform with the CUT 3000 S: X/Y/Z travels of 500 x 350 x 256 mm, U/V travel of ±70 mm, 400 kg workpiece capacity, and maximum workpiece dimensions of 1050 x 650 x 250 mm. The distinguishing technology is the laser interferometer calibration of the axis positioning system, which maps and compensates for geometric errors across the full travel range with sub-micron resolution.

The IPG (Intelligent Power Generator) delivers surface finishes down to Ra 0.07 µm in multi-pass skim cutting, matching the CUT 3000 S. Wire diameter support ranges from 0.10 to 0.30 mm standard, with optional micro-wire capability down to 0.05-0.07 mm. The ±30° taper cutting capability covers standard die-clearance requirements.

The CUT 3000 X occupies a specific niche: medium-size precision components where the compact CUT 2000 X travel is insufficient but where ±1.5 µm positional accuracy remains mandatory. Semiconductor lead frame dies, larger multi-cavity connector tooling, and precision aerospace fixtures are typical applications.

Full Specifications

Parameter	Value
X / Y / Z Travel	500 x 350 x 256 mm (19.7 x 13.8 x 10.1 in)
U / V Travel	±70 mm (±2.8 in)
Max Workpiece Dimensions	1050 x 650 x 250 mm (41.3 x 25.6 x 9.8 in)
Max Workpiece Weight	400 kg (880 lb) with bath
Wire Diameter Range	0.10 - 0.30 mm (0.05-0.07 mm optional)
Total Positioning Accuracy	±1.5 µm (laser-calibrated)
Min Surface Finish Ra	0.07 µm
Max Taper Angle	±30° / 100 mm height
Max Wire Spool Weight	25 kg
Control System	AC CUT HMI with IPG technology
Generator	Intelligent Power Generator (IPG)
Dielectric	Deionized water
Travel X Y Z	350 x 250 x 256 mm13.77 x 9.84 x 10 in
Min Surface Roughness Ra	0.05 μm2 μin
Max Taper Angle Height	± 30°/100 mm± 30°/3.93 in
Max Workpiece Dimensions	750 x 550 x 250 mm29.5 x 21.6 x 9.8 in
Max Workpiece Weight	200 kg
Travel U V	± 70 mm± 2.7 in
Wire Diameters	0.10 - 0.30 (0.05-0.07 optional) mm0.004 - 0.012 (0.002-0.003 optional) in
Max Wire Spool Weight	25 kg55.11 lbs

Specifications sourced from gfms.com — verified 2026-03-28

Strengths & Limitations

Strengths

Laser-calibrated ±1.5 µm positioning accuracy on a 500 x 350 mm travel platform
Expanded work envelope accommodates medium-size die plates and larger tooling
Ra 0.07 µm surface finish capability with IPG generator technology
400 kg workpiece capacity handles progressive die components and heavier tooling
Optional micro-wire (0.05-0.07 mm) for ultra-fine detail on a larger machine
AC CUT HMI with full technology database for efficient parameter selection

Limitations

Highest-priced model in the CUT 2000/3000 series reflects combined accuracy and travel premium
Best accuracy requires temperature-controlled environment for ±1.5 µm specification
256 mm Z-travel limits workpiece height for taller components
Laser calibration premium may not be justified for standard-tolerance mold work

Best For

Semiconductor lead frame and connector die manufacturers needing sub-micron accuracy on larger tooling Multi-cavity precision mold insert production where positional accuracy across the full travel is critical Aerospace fixture and tooling manufacturers with medium-size precision components Precision die shops requiring both large travel and the tightest achievable dimensional tolerances Quality-critical applications where parts are inspected on CMMs and must meet ±2 µm specifications

Frequently Asked Questions

01 When should I choose the CUT 3000 X over the CUT 3000 S?

Choose the CUT 3000 X when your applications require sub-micron positional accuracy — semiconductor tooling, precision connector dies, and components inspected to CMM standards tighter than ±3 µm. If surface finish quality is the primary concern and ±3-5 µm accuracy is sufficient, the CUT 3000 S delivers equivalent finish at lower cost.

02 Is the CUT 3000 X accuracy maintained across the full 500 x 350 mm travel?

Yes. The laser calibration maps and compensates for geometric errors across the entire travel range. This is where the X-series advantage is most significant — on larger-travel machines, uncalibrated positioning errors accumulate more over longer distances.

03 Can the CUT 3000 X replace both a CUT 2000 X and a standard mid-size wire EDM?

In many shops, yes. The CUT 3000 X covers both compact precision work (within its travel range) and medium-size tooling that exceeds the CUT 2000 X envelope, with ±1.5 µm accuracy throughout. This consolidation can be more cost-effective than running two separate machines.

04 What maintenance does the laser calibration system require?

The laser calibration is performed during factory commissioning and periodic service intervals. GF recommends recalibration annually or after any machine relocation. The calibration compensation maps stored in the control do not degrade in normal operation.