GF Machining AgieCharmilles CUT 2000 X

$260,000 - $380,000 Updated 2026-03-19

Key Specifications

X / Y / Z Travel

350 x 250 x 256 mm (13.8 x 9.8 x 10.1 in)

U / V Travel

±70 mm (±2.8 in)

Max Workpiece Dimensions

750 x 550 x 250 mm (29.5 x 21.7 x 9.8 in)

Max Workpiece Weight

200 kg (440 lb) with bath

Wire Diameter Range

0.10 - 0.30 mm (0.05-0.07 mm optional)

Total Positioning Accuracy

±1.5 µm (laser-calibrated)

Overview

The GF Machining Solutions AgieCharmilles CUT 2000 X is the accuracy-optimized variant of GF's CUT 2000 series, engineered for applications where absolute dimensional precision is the overriding requirement. While sharing the same mechanical platform and travel dimensions as the CUT 2000 S, the CUT 2000 X incorporates laser-calibrated axis positioning that achieves total positioning accuracy down to ±1.5 µm — a level of geometric precision that places it among the most accurate compact wire EDMs available.

With X/Y/Z travels of 350 x 250 x 256 mm and U/V travel of ±70 mm, the CUT 2000 X targets the same compact precision work envelope as its S-series sibling: mold inserts, medical device tooling, watch components, and micro-feature profiles. The critical difference is the laser calibration methodology applied to the machine's axis positioning system, which maps and compensates for geometric errors across the full travel range with sub-micron resolution.

The IPG (Intelligent Power Generator) delivers the same high-quality surface finishes as the CUT 2000 S, with Ra 0.07 µm achievable in multi-pass skim cutting. Wire diameter support ranges from 0.10 to 0.30 mm standard, with optional micro-wire capability down to 0.05-0.07 mm for ultra-fine detail work. The combination of sub-micron positioning accuracy and mirror-class surface finish makes the CUT 2000 X the choice for the most demanding precision applications in medical, watchmaking, and semiconductor tooling.

The AC CUT HMI control provides GF's comprehensive technology database, and the ±30° taper cutting capability over 100 mm height covers all standard die-clearance angle requirements.

Full Specifications

Parameter	Value
X / Y / Z Travel	350 x 250 x 256 mm (13.8 x 9.8 x 10.1 in)
U / V Travel	±70 mm (±2.8 in)
Max Workpiece Dimensions	750 x 550 x 250 mm (29.5 x 21.7 x 9.8 in)
Max Workpiece Weight	200 kg (440 lb) with bath
Wire Diameter Range	0.10 - 0.30 mm (0.05-0.07 mm optional)
Total Positioning Accuracy	±1.5 µm (laser-calibrated)
Min Surface Finish Ra	0.07 µm
Max Taper Angle	±30° / 100 mm height
Max Wire Spool Weight	25 kg
Control System	AC CUT HMI with IPG technology
Generator	Intelligent Power Generator (IPG)
Dielectric	Deionized water
Travel X Y Z	350 x 250 x 256 mm13.77 x 9.84 x 10 in
Min Surface Roughness Ra	0.05 μm2 μin
Max Taper Angle Height	± 30°/100 mm± 30°/3.93 in
Max Workpiece Dimensions	750 x 550 x 250 mm29.5 x 21.6 x 9.8 in
Max Workpiece Weight	200 kg
Travel U V	± 70 mm± 2.7 in
Wire Diameters	0.10 - 0.30 (0.05-0.07 optional) mm0.004 - 0.012 (0.002-0.003 optional) in
Max Wire Spool Weight	25 kg55.11 lbs

Specifications sourced from gfms.com — verified 2026-03-28

Strengths & Limitations

Strengths

Laser-calibrated positioning accuracy of ±1.5 µm total — among the most accurate compact wire EDMs available
Mirror-class surface finish down to Ra 0.07 µm eliminates polishing on precision mold surfaces
IPG generator optimizes spark discharge for combined accuracy and surface quality
Optional micro-wire capability (0.05-0.07 mm) for ultra-fine detail cutting
Wide ±30° taper angle for complex die-clearance geometries
GF's proven AC CUT HMI with comprehensive technology database

Limitations

200 kg workpiece weight limit restricts use to smaller precision components
Premium pricing over the CUT 2000 S reflects laser calibration investment
350 x 250 mm X/Y travel limits workpiece size versus CUT 3000 series
Laser calibration advantage is most meaningful in temperature-controlled environments

Best For

Semiconductor and electronics tooling requiring sub-micron positional accuracy Watch component manufacturing with the tightest dimensional tolerances Medical device tooling where part accuracy directly affects implant fit and function Precision mold insert production combining tight tolerances with mirror finish Metrology-grade tooling and fixture manufacturing

Frequently Asked Questions

01 What does the laser calibration on the CUT 2000 X provide?

The CUT 2000 X uses laser interferometer measurement to map positional errors across the entire X/Y travel range. These error maps are stored in the control and applied as real-time compensation during cutting. The result is ±1.5 µm total positioning accuracy — significantly better than uncalibrated machines which may drift 3-5 µm across full travel.

02 Is the CUT 2000 X worth the premium over the CUT 2000 S?

The premium is justified when your applications require sub-micron positional accuracy — semiconductor tooling, watch components, and medical device tooling where every micron matters. For standard mold insert work where surface finish is the primary concern and ±3 µm accuracy is acceptable, the CUT 2000 S delivers equivalent performance at lower cost.

03 Does the CUT 2000 X require a temperature-controlled environment?

While the CUT 2000 X will achieve its best accuracy in a controlled environment (20°C ±2°C), the laser calibration compensation still provides accuracy improvements in standard shop environments. For the tightest ±1.5 µm specification, GF recommends temperature control.

04 What wire sizes does the CUT 2000 X support?

Standard wire range is 0.10 to 0.30 mm. Optional micro-wire packages extend capability down to 0.05-0.07 mm diameter for ultra-fine detail work. Standard production cutting uses 0.25 mm brass wire.