DMG Mori ULTRASONIC 20 linear

The DMG Mori ULTRASONIC 20 linear 3rd Generation is a precision 5-axis machining center that superimposes longitudinal ultrasonic vibration onto the rotating tool, reducing process forces by approximately 50% when machining hard and brittle materials. This technology enables productive machining of advanced ceramics, glass, sapphire, silicon carbide, and composite materials that would be extremely difficult or impossible with conventional milling.

Travel sits at 220 x 370 x 290 mm (8.7 x 14.6 x 11.4 in), placing this machine firmly in the small-part precision category. The A-axis tilts from +130 to -93 degrees with the C-axis providing continuous rotation at 150 RPM standard or 1,500 RPM optional. Maximum workpiece dimensions are 302 x 220 x 283 mm (11.9 x 8.7 x 11.1 in) with a table load capacity of 15 kg (33 lb).

The spindle reaches 42,000 RPM standard with an HSK-E32 interface, with options up to 60,000 RPM for the finest surface finishes on optical and semiconductor components. The ultrasonic actuation system integrated into the HSK-E32 toolholder superimposes a longitudinal vibration onto the tool rotation, with amplitudes configurable in the control.

The linear motor drives on all axes provide the positioning accuracy and surface finish quality required for optical components, semiconductor equipment, and medical implants manufactured from advanced ceramics and hard-brittle materials. The compact footprint makes this machine suitable for cleanroom-adjacent installations.

The SIEMENS control runs DMG Mori ULTRASONIC-specific technology cycles that automatically optimize ultrasonic parameters based on the material, tool, and cutting conditions. For manufacturers working with materials like zirconia, alumina, silicon carbide, glass, CFRP, and other hard-brittle or composite materials, the ULTRASONIC 20 linear provides a machining solution that conventional 5-axis machines simply cannot replicate. Specs sourced from DMG Mori published data.