DMG Mori LASERTEC 50 PrecisionTool

$600,000 - $1,000,000 Updated 2026-03-19

Key Specifications

X Travel

540 mm (21.3 in)

Y Travel

500 mm (19.7 in)

Z Travel

700 mm (27.6 in)

max tool diameter

355 mm (14.0 in)

max tool length

420 mm (16.5 in)

laser type

Femtosecond laser (cold ablation)

Overview

The DMG Mori LASERTEC 50 PrecisionTool is the larger-envelope sibling to the LASERTEC 20 PrecisionTool, designed for laser processing of PCD (polycrystalline diamond), CVD diamond, CBN (cubic boron nitride), carbide, and advanced materials including glass, ceramics, and tungsten carbide. Where the LASERTEC 20 targets small inserts and round tools up to 200 mm, the LASERTEC 50 handles tools up to 355 mm (14 in) diameter and 420 mm (16.5 in) length, covering the full range of production cutting tools.

Axis travels measure 540 x 500 x 700 mm (21.3 x 19.7 x 27.6 in), more than doubling the work envelope of the LASERTEC 20 in every axis. The machine uses femtosecond laser ablation technology for cold processing -- the ultrashort pulse duration removes material without thermal damage to the surrounding cutting edge, producing surface quality below Ra 0.00762 microinches on carbide tools. This cold ablation process eliminates the heat-affected zones that nanosecond and microsecond lasers produce.

Linear drives deliver acceleration exceeding 1g on all axes, enabling rapid positioning between features on multi-edge tools. Highly dynamic torque motors on the B and C rotary axes provide the angular speed and accuracy needed for processing complex 3D geometries on round tools, indexable inserts, and formed tools. The combination of linear and torque drives delivers the motion quality needed for sub-micrometer surface finishes.

The machine processes cutting tools without contact, without electrodes, and without tool wear -- eliminating the three primary cost drivers in conventional PCD grinding. Complex chip breaker geometries, micro-textured rake faces, and precision edge preparations that are impossible to grind are standard operations on the LASERTEC 50 PrecisionTool.

With a compact footprint of just 4 square meters, the machine fits into existing tool rooms and production cells. The SIEMENS control handles both tool measurement and laser processing programs. Compared to the LASERTEC 20, the LASERTEC 50 is the production-oriented machine for shops processing larger tools and higher volumes.

Full Specifications

Parameter	Value
X-Axis Travel	540 mm (21.3 in)
Y-Axis Travel	500 mm (19.7 in)
Z-Axis Travel	700 mm (27.6 in)
Max Tool Diameter	355 mm (14.0 in)
Max Tool Length	420 mm (16.5 in)
Laser Type	Femtosecond laser (cold ablation)
Surface Roughness	< Ra 0.00762 microinches on carbide
Linear Drives	Acceleration > 1g
Rotary Axes	B and C axes with torque motors
Materials Processed	PCD, CVD diamond, CBN, carbide, glass, ceramics, tungsten carbide
Processing Method	Contact-free, no electrodes, no tool wear
Floor Space Required	4 m2 (43 ft2)
CNC Control	SIEMENS
540 Mm	21.3 in.
500 Mm	19.7 in.
700 Mm	27.6 in.
Clearance	Max. X-axis travel540 mm21.3 in.Max. Y-axis travel500 mm19.7 in.Max. Z-axis travel700 mm27.6 in.

Specifications sourced from us.dmgmori.com — verified 2026-03-28

Strengths & Limitations

Strengths

Femtosecond cold ablation eliminates heat-affected zones that nanosecond lasers produce, delivering superior PCD edge quality
355 mm max tool diameter and 420 mm length handle the full range of production cutting tools including large face mills and reamers
Surface roughness below Ra 0.00762 microinches on carbide enables mirror-finish rake faces for high-performance cutting tools
Linear drives with greater than 1g acceleration and torque motor rotary axes deliver the motion dynamics needed for complex 3D tool geometries
Contact-free processing eliminates diamond wheel consumption, electrode wear, and mechanical forces on delicate PCD edges
540 x 500 x 700 mm travel envelope more than doubles the LASERTEC 20's workspace for larger tooling applications

Limitations

Femtosecond laser source adds significant cost over nanosecond systems, pushing pricing above $600K for most configurations
Material removal rates are inherently slower than grinding for bulk material removal on conventional carbide tools
Specialized femtosecond laser source requires trained service technicians and higher maintenance costs than conventional lasers
Limited to tool processing applications -- not a general-purpose laser cutting or machining platform

Best For

PCD cutting tool manufacturers producing high-performance inserts and round tools for automotive and aerospace industries Large cutting tool companies processing tools up to 355 mm diameter that exceed the LASERTEC 20's capacity Aerospace and automotive OEM tool rooms processing CVD diamond and CBN tools for composite and hardened steel machining Tool grinding companies adding femtosecond laser capability for micro-textured and complex chip breaker geometries Research institutions developing next-generation cutting tool edge preparations and surface textures

Frequently Asked Questions

01 What does a LASERTEC 50 PrecisionTool cost?

Pricing typically ranges from $600,000 to $1,000,000 depending on laser source configuration, measurement options, and software packages. The femtosecond laser source is the primary cost driver.

02 How does the LASERTEC 50 compare to the LASERTEC 20 PrecisionTool?

The LASERTEC 50 handles tools up to 355 mm diameter vs 200 mm on the 20, with travels of 540 x 500 x 700 mm vs 200 x 200 x 200 mm. The 50 uses femtosecond laser technology for cold ablation, while the 20 uses nanosecond pulses. The 50 is the production machine for larger tools and higher volumes.

03 What is femtosecond laser ablation?

Femtosecond lasers deliver pulses shorter than one trillionth of a second. At these durations, material is removed by direct vaporization before heat can conduct into surrounding material. This cold ablation produces no heat-affected zone, preserving the full hardness and structure of PCD, CBN, and diamond cutting edges.

04 Can it process materials beyond cutting tools?

Yes, the femtosecond laser can process glass, ceramics, and tungsten carbide in addition to cutting tool materials. However, the machine is optimized for cutting tool geometry and fixturing.