DMG Mori LASERTEC 20 PrecisionTool
Key Specifications
X Travel
Y Travel
Z Travel
Accuracy
Repeatability
a axis tilt
Overview
The DMG Mori LASERTEC 20 PrecisionTool is a 5-axis laser processing center built specifically for manufacturing and resharpening PCD (polycrystalline diamond), CVD diamond, CBN (cubic boron nitride), and carbide cutting tools. Where conventional grinding of PCD tools is slow, creates poor edge quality, and wears diamond wheels at punishing rates, the LASERTEC 20 PrecisionTool uses a pulsed fiber laser to cut and shape these ultrahard materials without mechanical contact.
Travel sits at 200 x 200 x 200 mm (7.9 x 7.9 x 7.9 in) on the linear axes. The A-axis tilts +/-110 degrees and the C-axis rotates 360 degrees continuous, providing full angular access to cutting edges, chip breakers, and rake faces. Positioning accuracy is 1 micrometer with repeatability under 0.5 micrometers -- the kind of precision that PCD tool geometry demands.
The fiber laser delivers up to 200 W of average power with nanosecond pulse durations. For PCD tools, the laser ablates the diamond material along programmed edge profiles, creating sharper cutting edges than grinding can achieve. Edge radii down to 2 micrometers are standard, with surface roughness on the rake face under Ra 0.2 micrometers. The laser also cuts complex chip breaker geometries that would be impossible to grind.
The machine comes with dedicated tool-making software that imports standard tool geometry formats and generates laser paths automatically. An integrated tool measurement system uses a vision camera and touch probe to align tools before processing and verify geometry after. The compact footprint of approximately 2 x 2 meters makes it suitable for tool rooms and small production cells.
PCD insert production, tool resharpening, and prototype tool development are the primary applications. The machine handles round tools up to 200 mm diameter and indexable inserts of all standard geometries. Pricing typically falls in the 00,000 to 00,000 range.
Full Specifications
| Parameter | Value |
|---|---|
| X-Axis Travel | 200 mm (7.9 in) |
| Y-Axis Travel | 200 mm (7.9 in) |
| Z-Axis Travel | 200 mm (7.9 in) |
| A Axis Tilt | +/-110 degrees |
| C Axis Rotation | 360 degrees continuous |
| Laser Type | Pulsed fiber laser |
| Laser Power | Up to 200 W average |
| Pulse Duration | Nanoseconds |
| Edge Radius | Down to 2 micrometers |
| Surface Roughness | < Ra 0.2 micrometers on rake face |
| Max Tool Diameter | 200 mm (7.87 in) |
| Positioning Accuracy | 1 micrometer |
| Repeatability | < 0.5 micrometers |
| CNC Control | CELOS with tool-making software |
| 200 Mm | 7.9 in. |
| 400 Mm | 15.7 in. |
| 280 Mm | 11 in. |
| Clearance | Max. X-axis travel200 mm7.9 in.Max. Y-axis travel400 mm15.7 in.Max. Z-axis travel280 mm11 in. |
Specifications sourced from us.dmgmori.com — verified 2026-03-28
Strengths & Limitations
Strengths
- Creates sharper PCD cutting edges than grinding with edge radii down to 2 micrometers, improving tool performance and part surface finish
- Cuts complex chip breaker geometries on PCD and CBN tools that are impossible to produce by grinding
- No diamond wheel wear eliminates a major consumable cost and consistency variable in PCD tool production
- 5-axis access enables processing of all tool surfaces including rake face, clearance angles, and chip breakers in one setup
- Integrated measurement system aligns and verifies tool geometry automatically, reducing setup time and scrap
- Compact 2 x 2 meter footprint fits in existing tool rooms without major facility modifications
- Processes PCD, CVD diamond, CBN, and carbide -- covering the full range of ultrahard cutting tool materials
Limitations
- 00K-00K price puts it beyond reach of most small tool grinding shops; requires high PCD tool volume to justify
- Material removal rates on bulk carbide are much slower than grinding; this is a finishing and precision geometry tool
- Nanosecond laser leaves a small heat-affected zone on PCD that must be accounted for in tool design
- Limited to 200 mm max tool diameter and 200 mm axis travels -- large face mills and boring bars will not fit
- Requires laser processing expertise that most tool grinder operators will need training to develop
Best For
Frequently Asked Questions
01
Typically 00,000 to 00,000 depending on laser source options, measurement system configuration, and software packages. Volume PCD tool producers sometimes negotiate favorable pricing.
02
Laser processing produces sharper edges (2 micrometer radius vs 5-10 for grinding), handles complex chip breaker geometry that grinding cannot produce, and eliminates diamond wheel consumable costs. Grinding is faster for simple straight edges and bulk material removal.
03
PCD (polycrystalline diamond), CVD diamond, CBN (cubic boron nitride), carbide, cermet, and ceramic tool materials. PCD and CVD diamond are the primary applications where laser has the biggest advantage over grinding.
04
Yes, tool resharpening is a primary application. The integrated measurement system scans existing tool geometry, and the software generates resharpening paths that restore original edge profiles and chip breakers.
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